Kostec Material to Exhibit at PACK EXPO International 2026 in Chicago

Kostec Material is pleased to announce its participation in PACK EXPO International 2026, taking place October 18–21 at McCormick Place in Chicago. Visitors can meet the team at Booth LL-10214 to explore packaging solutions and discuss new opportunities for cooperation.

This year, Kostec Material will highlight three solutions designed around everyday packaging needs. 

anti-fog easy-peel lidding films offer clear product visibility, reliable sealing and smooth opening for food trays. 

Resealable lidding films allow consumers to open and reclose a pack 

ventilated mesh bags provide airflow and practical retail presentation for onions, potatoes and other fresh produce.

Kostec Material is also pleased to share its partnership with Huangshan Novel Co., Ltd. (Yongxin). As Yongxin’s exclusive agent for the U.S. and European markets, Kostec Material looks forward to bringing its packaging materials and solutions to more customers across these regions.

“We look forward to meeting customers and partners in Chicago, learning about their packaging challenges and exploring what we can achieve together,” said the Kostec Material team.

Visit Kostec Material at Booth LL-10214, October 18–21, 2026, at McCormick Place in Chicago, Illinois.